Landfill Assessment and Monitoring System (LAMS)

Description

Technologies used to assess and monitor hazardous and mixed-waste (i.e., hazardous waste mixed with radioactive waste) in landfills are not integrated. Sandia National Laboratory is developing an approach for site assessment and monitoring that helps select and integrate the technologies. Called the Landfill Assessment and Monitoring System (LAMS), it consists of five separate subsystems: (1) screening and sampling optimization techniques, (2) innovative drilling technologies, (3) on-site analysis and in-situ sensors, (4) subsurface monitoring technologies and sampling, and (5) risk analysis and on-site data evaluation and visualization technologies. This system attempts to maximize data gathered while minimizing costs, worker exposure, and time expended. It emphasizes the least intrusive technologies, relying upon down hole sensors when possible.

Limitations and Concerns

The description of LAMS does not provide enough information to be confident that this system is something new in landfill assessment.

While a focus on minimally intrusive and in-situ data-gathering techniques reduces the risk of worker exposure to wastes or contaminated media, data must be adequate to make decisions about the proper remediation strategy and post-closure monitoring regime.

Applicability

LAMS is envisioned to be a start-to-finish system for landfill assessment. It is designed for hazardous waste and mixed waste landfills.

Technology Development Status

The LAMS project description states that it has produced technology transfers through partnerships, demonstrations, and implementation at environmental restoration sites. It is not clear, however, if a unified systems approach to landfill assessment has been developed. Thus, we refer to this project as a continuing field demonstration.

Web Links

http://www.sandia.gov/Subsurface/factshts/ert/lams.pdf

Other Resources and Demonstrations

See descriptions of Cross Borehole Electromagnetic Imaging, Horizontal Drilling and Sonic Drilling.